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| Product Name: |
COG LCD Display Modules
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COG LCD Display Modules |
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Chip-On-Glass (COG) is a flip chip bonding method which
is used for connect assembly of bare integrated circuits
on glass substrate directly by using Anisotropic Conductive Film .
The pitch of the IC bumps can be scaled down according to customers'
requirements . This method reduces the assembly area to the highest
possible packing density, which especially important to those
applications that ***ce saving is crucial. It allows a
cost-effective mounting of driver chips because integrating
flex PCB is no longer required. The IC is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.
http://www.blazedisplay.com
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| Company: |
Blaze Display Technology Co., Ltd
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| Contact: |
Mr. info li |
| Address: |
5/F, HSAE Tech Building, Hi-Tech Park, Nanshan, Shenzhen, 518057, China |
| Postcode: |
518000 |
| Tel: |
86-755-86524100 |
| Fax: |
86-755-86524101 |
| E-mail: |
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